1XM73AA HP 2.1GHz 11MB L3 Cache Intel Xeon Silver 4116 12 Core Processor Kit for Z6 G4 Workstation
$2,959.50
MPN: | 1XM73AA |
Manufacturer: | HP |
Detail: |
1XM73AA HP 2.1GHz 11MB L3 Cache Intel Xeon Silver 4116 12 Core Processor Kit for Z6 G4 Workstation
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Price: | $2,959.50 |
Availability: | In Stock |
Quantity |
General Information
1XM73AA HP 2.1GHz 11MB L3 Cache Intel Xeon Silver 4116 12 Core Processor Kit for Z6 G4 Workstation
Technical Specs
Manufacturer | HP |
Manufacturer Part # | 1XM73AA |
Processor generation | 1st Generation Intel® Xeon® Scalable |
Processor model | 4116 |
Processor base frequency | 2.1 GHz |
Processor family | Intel Xeon Silver |
Processor cores | 12 |
Processor socket | LGA 3647 (Socket P) |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor series | Intel Xeon Silver 4000 Series |
Processor threads | 24 |
Processor operating modes | 64-bit |
Processor boost frequency | 3 GHz |
Processor cache | 16 MB |
Processor cache type | L3 |
Thermal Design Power (TDP) | 85 W |
Cooler included | no |
Stepping | M0 |
Processor codename | Skylake |
Maximum internal memory supported by processor | 768 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
ECC | yes |
On-board graphics card | no |
Execute Disable Bit | yes |
Market segment | Server |
Maximum number of PCI Express lanes | 48 |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | 2S |
Embedded options available | yes |
HP segment | Business |
Intel® Hyper Threading Technology (Intel® HT Technology) | yes |
Intel® Turbo Boost Technology | 2.0 |
Intel® AES New Instructions (Intel® AES-NI) | yes |
Enhanced Intel SpeedStep Technology | yes |
Intel Trusted Execution Technology | yes |
Intel® Speed Shift Technology | yes |
Intel VT-x with Extended Page Tables (EPT) | yes |
Intel TSX-NI | yes |
Intel 64 | yes |
Intel Virtualization Technology (VT-x) | yes |
Intel Virtualization Technology for Directed I/O (VT-d) | yes |
Intel Turbo Boost Max Technology 3.0 | no |
Intel® Optane™ Memory Ready | no |
Intel® vPro™ Platform Eligibility | yes |
Tcase | 76 °C |
Package width | 399 mm |
Package depth | 203 mm |
Package height | 156 mm |
Compatibility | Z8G4 |
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