733730-001 HP Intel Xeon Six-Core E5-1650v2 3.5GHz 12MB L3 Cache Socket FCLGA2011 22nm 130w Processor
| MPN: | 733730-001 |
| Manufacturer: | HP |
| Detail: |
733730-001 HP Intel Xeon Six-Core E5-1650v2 3.5GHz 12MB L3 Cache Socket FCLGA2011 22nm 130w Processor
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| Availability: | In Stock |
| Quantity |
General Information
733730-001 HP Intel Xeon Six-Core E5-1650v2 3.5GHz 12MB L3 Cache Socket FCLGA2011 22nm 130w Processor
Technical Specs
| Manufacturer | HP |
| Manufacturer Part # | 733730-001 |
| Processor model | E5-1650V2 |
| Processor base frequency | 3.5 GHz |
| Processor family | Intel® Xeon® E5 V2 Family |
| Processor cores | 6 |
| Processor socket | LGA 2011 (Socket R) |
| Component for | Server/workstation |
| Processor lithography | 22 nm |
| Processor threads | 12 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.9 GHz |
| Processor cache | 12 MB |
| Processor cache type | L3 |
| Thermal Design Power (TDP) | 70 W |
| VID Voltage Range | 0.65 - 1.30 V |
| Bus type | QPI |
| Memory bandwidth supported by processor (max) | 59.7 GB/s |
| Maximum internal memory supported by processor | 256 GB |
| Memory types supported by processor | DDR3-SDRAM |
| Memory clock speeds supported by processor | 800, 1066, 1333, 1600, 1866 MHz |
| Memory channels | Quad-channel |
| ECC | yes |
| On-board graphics card | no |
| Execute Disable Bit | yes |
| Idle States | yes |
| Thermal Monitoring Technologies | yes |
| Market segment | Server |
| Maximum number of PCI Express lanes | 40 |
| PCI Express slots version | 3.0 |
| Embedded options available | no |
| Intel® Hyper Threading Technology (Intel® HT Technology) | yes |
| Intel® Identity Protection Technology (Intel® IPT) | no |
| Intel® Turbo Boost Technology | yes |
| Intel Flex Memory Access | no |
| Intel® Smart Cache | yes |
| Intel® AES New Instructions (Intel® AES-NI) | yes |
| Enhanced Intel SpeedStep Technology | yes |
| Intel Trusted Execution Technology | yes |
| Intel VT-x with Extended Page Tables (EPT) | yes |
| Intel Demand Based Switching | yes |
| Intel TSX-NI | no |
| Intel Virtualization Technology (VT-x) | yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | yes |
| Intel® vPro™ Platform Eligibility | yes |
| Tcase | 70 °C |
| Package width | 52.5 mm |
| Package depth | 45 mm |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
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