840397-B21 HP 3.00GHz 10.40GT/s UPI 24.75MB L3 Cache Intel Xeon Platinum 8158 12 Core Processor for DL560 Gen10 Server
| MPN: | 840397-B21 |
| Manufacturer: | HP |
| Detail: |
840397-B21 HP 3.00GHz 10.40GT/s UPI 24.75MB L3 Cache Intel Xeon Platinum 8158 12 Core Processor for DL560 Gen10 Server
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| Availability: | In Stock |
| Quantity |
General Information
840397-B21 HP 3.00GHz 10.40GT/s UPI 24.75MB L3 Cache Intel Xeon Platinum 8158 12 Core Processor for DL560 Gen10 Server
Technical Specs
| Manufacturer | HP |
| Manufacturer Part # | 840397-B21 |
| Processor generation | 1st Generation Intel® Xeon® Scalable |
| Processor model | 8158 |
| Processor base frequency | 3 GHz |
| Processor family | Intel® Xeon® Platinum |
| Processor cores | 12 |
| Processor socket | LGA 3647 (Socket P) |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor series | Intel Xeon Platinum 8000 Series |
| Processor threads | 24 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.7 GHz |
| Processor cache | 24.75 MB |
| Processor cache type | L3 |
| Thermal Design Power (TDP) | 150 W |
| Cooler included | no |
| Stepping | H0 |
| Processor codename | Skylake |
| Maximum internal memory supported by processor | 768 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory channels | Hexa-channel |
| ECC | yes |
| On-board graphics card | no |
| Market segment | Server |
| Maximum number of PCI Express lanes | 48 |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | S8S |
| Embedded options available | no |
| Intel® Hyper Threading Technology (Intel® HT Technology) | yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® AES New Instructions (Intel® AES-NI) | yes |
| Intel Trusted Execution Technology | yes |
| Intel® Speed Shift Technology | yes |
| Intel TSX-NI | yes |
| Intel 64 | yes |
| Intel Virtualization Technology (VT-x) | yes |
| Conflict-Free processor | yes |
| Intel® Optane™ Memory Ready | no |
| Intel® vPro™ Platform Eligibility | yes |
| Tcase | 85 °C |
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