BX806738176 Intel Xeon Platinum 8176 28-Core 2.10GHz 3 UPI Link 38.5MB L3 Cache Socket FCLGA3647 Processor
| MPN: | BX806738176 |
| Manufacturer: | Intel |
| Detail: |
BX806738176 Intel Xeon Platinum 8176 28-Core 2.10GHz 3 UPI Link 38.5MB L3 Cache Socket FCLGA3647 Processor
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| Availability: | In Stock |
| Quantity |
General Information
BX806738176 Intel Xeon Platinum 8176 28-Core 2.10GHz 3 UPI Link 38.5MB L3 Cache Socket FCLGA3647 Processor
Technical Specs
| Manufacturer | Intel |
| Manufacturer Part # | BX806738176 |
| Processor manufacturer | Intel |
| Processor generation | 1st Generation Intel® Xeon® Scalable |
| Processor model | 8176 |
| Processor base frequency | 2.1 GHz |
| Processor family | Intel® Xeon® |
| Processor cores | 28 |
| Processor socket | LGA 3647 (Socket P) |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor threads | 56 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.8 GHz |
| Processor cache | 38.5 MB |
| Processor cache type | L3 |
| Thermal Design Power (TDP) | 165 W |
| Box | yes |
| Number of QPI links | 3 |
| Processor ARK ID | 120508 |
| Maximum internal memory supported by processor | 768 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory channels | Hepta-channel |
| ECC | yes |
| On-board graphics card | no |
| Market segment | Server |
| Maximum number of PCI Express lanes | 48 |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | S8S |
| Embedded options available | no |
| Intel® Hyper Threading Technology (Intel® HT Technology) | yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® AES New Instructions (Intel® AES-NI) | yes |
| Intel Trusted Execution Technology | yes |
| Intel® Speed Shift Technology | yes |
| Intel TSX-NI | yes |
| Intel 64 | yes |
| Intel Virtualization Technology (VT-x) | yes |
| Conflict-Free processor | yes |
| Intel Turbo Boost Max Technology 3.0 | no |
| Intel® Optane™ Memory Ready | no |
| Intel® vPro™ Platform Eligibility | yes |
| Tcase | 89 °C |
| Harmonized System (HS) code | 85423119 |
| Processor package size | 76 x 56.5 mm |
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