CM8064601467001S Intel Xeon E3-1280 v3 Quad Core 3.60GHz 5.00GT/s DMI 8MB L3 Cache Socket FCLGA1150 Processor
| MPN: | CM8064601467001S |
| Manufacturer: | Intel |
| Detail: |
CM8064601467001S Intel Xeon E3-1280 v3 Quad Core 3.60GHz 5.00GT/s DMI 8MB L3 Cache Socket FCLGA1150 Processor
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| Availability: | In Stock |
| Quantity |
General Information
CM8064601467001S Intel Xeon E3-1280 v3 Quad Core 3.60GHz 5.00GT/s DMI 8MB L3 Cache Socket FCLGA1150 Processor
Technical Specs
| Manufacturer | Intel |
| Manufacturer Part # | CM8064601467001S |
| Processor manufacturer | Intel |
| Processor model | E3-1280V3 |
| Processor base frequency | 3.6 GHz |
| Processor family | Intel® Xeon® E3 V3 Family |
| Processor cores | 4 |
| Processor socket | LGA 1150 (Socket H3) |
| Component for | Server/workstation |
| Processor lithography | 22 nm |
| Processor series | Intel Xeon E3-1200 v3 |
| Processor threads | 8 |
| System bus rate | 5 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Processor cache | 8 MB |
| Processor cache type | Smart Cache |
| Thermal Design Power (TDP) | 82 W |
| Box | no |
| Stepping | C0 |
| Bus type | DMI |
| Memory bandwidth supported by processor (max) | 25.6 GB/s |
| Processor codename | Haswell |
| Processor code | SR150 |
| Processor ARK ID | 75057 |
| Maximum internal memory supported by processor | 32 GB |
| Memory types supported by processor | DDR3-SDRAM, DDR3L-SDRAM |
| Memory clock speeds supported by processor | 1333, 1600 MHz |
| Memory voltage supported by processor | 1.5 V |
| Memory channels | Dual-channel |
| ECC | yes |
| On-board graphics card | no |
| Execute Disable Bit | yes |
| Idle States | yes |
| Thermal Monitoring Technologies | yes |
| Market segment | Server |
| Maximum number of PCI Express lanes | 16 |
| PCI Express slots version | 3.0 |
| PCI Express configurations | 1x16, 1x8+2x4, 2x8 |
| Supported instruction sets | AVX 2.0, SSE4.1, SSE4.2 |
| Scalability | 1S |
| CPU configuration (max) | 1 |
| Embedded options available | no |
| Graphics & IMC lithography | 22 nm |
| Thermal solution specification | PCG 2013D |
| Intel® Anti-Theft Technology (Intel® AT) | yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | yes |
| Intel® Identity Protection Technology (Intel® IPT) | yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Fast Memory Access | yes |
| Intel Flex Memory Access | yes |
| Intel® Smart Cache | yes |
| Intel® AES New Instructions (Intel® AES-NI) | yes |
| Enhanced Intel SpeedStep Technology | yes |
| Intel Trusted Execution Technology | yes |
| Intel Enhanced Halt State | yes |
| Intel VT-x with Extended Page Tables (EPT) | yes |
| Intel® Secure Key | yes |
| Intel TSX-NI | yes |
| Intel Stable Image Platform Program (SIPP) | yes |
| Intel® OS Guard | yes |
| Intel 64 | yes |
| Intel Virtualization Technology (VT-x) | yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | yes |
| Conflict-Free processor | yes |
| Intel® vPro™ Platform Eligibility | yes |
| Processor package size | 37.5 x 37.5 mm |
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